International Summer School in Engineering & Science
The Summer School in Engineering & Science is an opportunity for outstanding undergraduate and postgraduate students from all over the world to enhance their academic profiles with a rigorous and challenging academic experience at Israel’s oldest university and premier center for science, technology and applied research.
Students may enroll in one advanced course chosen from a variety of engineering and science fields in addition to one academic course on Israeli culture. These advanced courses are taught by Technion’s top level faculty in English at cutting-edge facilities.
Scholarships for excellent students from China and India are available (not applicable to Hong Kong, Macau, Taiwan candidates).
The program is open to senior undergraduate students (approaching Senior year), graduate students (MSc/PhD), and recent graduates. Outstanding sophomore undergraduates students may apply but should be aware that the program is highly competitive and requires a strong background in the chosen course, for this reason senior applicants may be given precedence.
Upon successful completion of the program students will receive 4-5 Technion academic credits. 2-3 credits for main selected course and 2 credits for Israeli culture course. students will receive Technion academic transcripts.
Scholarships for Students from China and India
This program is highly subsidized by the Israeli government and Technion. Costs for selected students for the program from India and China will be as follows:
- $50 non-refundable application fee
- $550 registration fee
Costs will include
- Academic courses tuition
- Lunch – students will be given 5 meal vouchers per week to be used in the Technion campus (valid at most cafeterias)
- Touristic trips to Jerusalem, Dead-Sea and North of Israel (3 days)
- Entrance to Technion facilities – swimming pool and gym
- All activities – social and academic
Chinese Scholarship Council (CSC) may provide additional funding for airfare to students from China. Please refer to the CSC website for further information.
Please note that the scholarships are not applicable to Hong Kong, Macau and Taiwan candidates.
All students will reside at Technion Senate dormitories (Upper Block Dormitory). Each apartment has 3 rooms, 2 students per room, joint bathroom, toilets and kitchen.
Trips, Social and Cultural Activities
To enrich the learning experience, students will be invited to participate in social and cultural activities both on and off campus such as lectures and trips, including industry visits and tours to major Israeli tourist attractions. Students will also visit cutting-edge laboratories and meet Technion faculty, and they will engage with lunchtime speakers providing in-depth exposure to Israeli and Middle Eastern culture and history. Campus social activities are led by Technion International’s experienced student guides.
Technion is Israel’s premier institute for science, technology and applied research. The university has trained most of the country’s top engineers and managers, and it stands at the forefront of cutting-edge industry-related research. Watch Technion’s involvement in Israel’s booming high-tech and start-up economy:
Technion Nation – Building Israel the Start-Up Nation
Technion Nation – Building Israel the Start-Up Nation (Chinese – Youku)
Technion – The Start-Up Nation’s University
Technion 101 Years Movie (Chinese subtitles YOUKU)
Support & Assistance
Technion International trains student guides to assist visiting students with a wide range of questions and issues. The Technion International team also organizes special events, trips and activities open to all international students on campus, that enrich their study experiences in Israel.
Before entering the academic program, all students must check their eligibility status for a student visa (type A2) with the Israeli embassy or consulate in their country of origin.
* Opening of the program is contingent on the number of registered students.
** The program is subject to changes, at the discretion of TI.
For more information please click "Further Official Information" below.